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TSMC has grown bolder in the chip industry in recent years. According to the latest news, it has reached a major domestic breakthrough in the 2nm process. It also points out that it can enter the mass production stage as early as 2023. Continue to develop the 1nm process thereafter.
According to reports, TSMC has made a major domestic breakthrough in the 2nm process. It abandons the FinFET which has lasted for many years and doesn’t even use GAAFET, or nanowire, but expands it into MBCFET nanosheet, which greatly improves circuit control and reduces the loss rate. TSMC has not announced the R&D costs required to develop the 2nm process, but according to Samsung’s $ 480 million (approximately HK $ 3.7 billion) announced during development of the 5nm process, they should actually exceed this figure.
According to market estimates, its 2nm process is expected to undergo risky trial production in the second half of 2023 and enter the mass production phase in 2024. In this regard, TSMC said the 2nm breakthrough will increase further. once the gap with competitors and will continue to develop the 1nm process later. TSMC predicts that Apple, Qualcomm, NVIDIA, AMD, etc. They should take the lead in adopting its 2nm process.
Source: cnbeta
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